Daniel L. Revier
he/him

News

December 13, 2022
I made this webpage in order to present my work to the world. It is currently a work in progress.

About Me

I am a PhD student at the University of Washington Computer Science Department. My focus in on computational fabrication of mechanical metamaterials with stochastic or regular connectivity.

This is my academic homepage. I received my undergraduate degree from Texas A&M University in Electrical Engineering in 2012. I then worked full-time at the Georgia Tech Research Institute as a research engineer designing high-power radar systems. Simultaneously, I completed my master's degree in Electrical Engineering by creating a one-tool, hybrid-manufacturing approach to fabricating planar radio frequency structures. I then took a job at Texas Instruments where I was the principle engineer applying inkjet printing technology to wafer level packaging.

I returned to academic life in 2019 after working at Texas Instruments. In my time working with 3D printing (aka additive manufacturing aka digital fabrication) I felt that software was the limiting factor in unlocking the full capabilities. This began my search for a PhD program where I could apply my hardware/fabrication background toward an application of enhancing people's abilities to design complicated and intricate objects.

At the University of Washington I am focused on fabrication and simulation of mechanical metamaterials. My work spans planar materials as well as three dimensional stochastic foam-like materials. I apply mathematics, continuum mechanics, and physical simulation techniques to turn the intractable space of metamaterial design into an intutive and accessible design space.

Publications (in reverse chronological order) Google Scholar

• Applied Viscous Thread Instability for Manufacturing 3D Printed Foams
  Brett Emery, Daniel Revier, Jeff Lipton
  Proceedings of the 7th Annual ACM Symposium on Computational Fabrication, 1-2
• Expanding the Design Space for Electrically-Driven Soft Robots Through Handed Shearing Auxetics
  I Good, T Brown-Moore, A Patil, D Revier, JI Lipton
  2022 International Conference on Robotics and Automation (ICRA), 10951-10957, 2022
• Kinematic Modeling of Handed Shearing Auxetics via Piecewise Constant Curvature
  A Garg, I Good, D Revier, K Airis, J Lipton
  2022 IEEE 5th International Conference on Soft Robotics (RoboSoft), 423-430, 2022
• The Principles of "Smart" Encapsulation: Using Additive Printing Technology for the Realization of Intelligent Application-Specific Packages for IoT, 5G, and Automotive Radar Applications
  B Tehrani, R Bahr, D Revier, B Cook, M Tentzeris
  2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 111-117, 2018
• A low-cost, single platform, hybrid manufacturing system for RF passives
  DL Revier, MM Tentzeris
  2017 IEEE Radio and Wireless Symposium (RWS), 83-85, 2017
• Additively manufactured nanotechnology and origami-enabled flexible microwave electronics
  JG Hester, S Kim, J Bito, T Le, J Kimionis, D Revier, C Saintsing, W Su, B Tehrani, A Traille, BS Cook, MM Tentzeris
  Proceedings of the IEEE 103 (4), 583-606, 2015
• Beam former development for the NASA Hurricane Imaging Radiometer
  G Hopkins, JR Skala, DL Revier, MW James, DE Simmons, CS Ruf, MC Bailey
  2015 IEEE Aerospace Conference, 1-15, 2015
• Inkjet-printed, vertically-integrated, high-performance inductors and transformers on flexible LCP substrate
  BS Cook, C Mariotti, JR Cooper, D Revier, BK Tehrani, L Aluigi, L Roselli, MM Tentzeris
  2014 IEEE MTT-S International Microwave Symposium (IMS2014), 1-4, 2014
• Beam former development for the NASA Hurricane Imaging Radiometer
  G Hopkins, JR Skala, DL Revier, MW James, DE Simmons, CS Ruf, MC Bailey
  2015 IEEE Aerospace Conference, 1-15, 2015

Projects

Coming soon...

Patents (in reverse chronological order) Google Scholar

• Molded Packaged Antenna
  L Stiborek, B Alexey, DL Revier
  US Patent 11,271,2960
• Nanoparticle Backside Die Adhesion Layer
  BS Cook, DL Revier, S Naseem, MH Chowdhury
  US Patent 11,031,364
• 3D Printed Semiconductor Package
  BS Cook, DL Revier
  US Patent 10,910,465
• Lens Cleaning Via Electrowetting
  DL Revier, BS Cook, DP Magee, SJ Fedigan
  US Patent 10,908,414
• Thermal Management in Integrated Circuit Using Phononic Bandgap Structure
  BS Cook, DL Revier
  US Patent 10,886,187
• Semiconductor Package with Liquid Metal Conductors
  DP Parekh, BS Cook, DL Revier, J Bito
  US Patent 10,879,151
• 3D Printed Semiconductor Package
  BS Cook, DL Revier
  US Patent 10,861,715
• Acoustic Management in Integrated Circuit Using Phononic Bandgap Structure
  DL Revier, BS Cook
  US Patent 10,833,648
• Integrated Circuit Using Photonic Bandgap Structure
  BS Cook, DL Revier
  US Patent 10,788,367
• Methods and Apparatus for Surface Wetting Control
  DL Revier, BS Cook, DP Magee, SJ Fedigan
  US Patent 10,780,467
• Integrated Circuit Package with Stress Directing Material
  BS Cook, DL Revier
  US Patent 10,622,270
• Spectrometry in Integrated Circuit Using a Photonic Bandgap Structure
  BS Cook, DL Revier
  US Patent 10,577,754
• Self-assembly of Semiconductor Die onto a Leadframe Using Magnetic Fields
  DL Revier, SA Kummerl, BS Cook
  US Patent 10,553,573
• Electromagnetic Interference Shield Within Integrated Circuit Encapsulation Using Photonic Bandgap Structure
  BS Cook, DL Revier
  US Patent 10,497,651
• Galvanic Signal Path Isolation in an Encapsulated Package Using a Photonic Structure
  BS Cook, DL Revier
  US Patent 10,444,432
• Integrated Circuit with Dielectric Waveguide Connector Using Photonic Bandgap Structure
  BS Cook, DL Revier
  US Patent 10,371,891
• Methods and Apparatus Providing a Graded Package for a Semiconductor
  DL Revier, BS Cook
  US Patent 10,170,3840